technical note power management lsi series for automotive body control regulators with voltage detector and watchdog timer bd3004hfp,bd3005hfp z description the bd3004hfp,bd3005hfp low bias current regulator and watchdog time r features a high 50 v breakdown voltage and is compatible with on-board vehicle microcontrollers. it offers an output current of 500 ma while limiting bias current to 80 a (typ.). the series supports the use of ceramic capacitors as output phase compensation capacitors.the reset detection voltage can be changed by connecting a resistor to the vs pin. bd3004hfp the watchdog timer can be switched on and off using the inh pin input logic. bd3005hfp z features 1) 5 v/500 ma regulators for microcontrollers bd3004hfp: adjustable detection voltage (vs pin) bd3005hfp:built-in watchdog timer re set circuit (inh pin: watchdog timer on/off) 2) super-low bias current: 80 a (typ.) 3) low-saturation voltage type p-channel dmos output transistors 4) high precision output voltage: 5 v 2% 5) low-esr ceramic capacitors can be used as output capacitors 6) vcc maximum applied voltage: 50 v 7) built-in overcurrent protection circuit and thermal shutdown circuit 8) built-in reverse connection breakdown prevention circuit 9) back current flow protection during sudden battery failures, making it a highly reliable 5 v regulator. 10) hrp7 package z applications onboard devices (vehicle equipment, car ster eos, satellite navigation systems, etc.) z absolute maximum ratings (ta = 25c) parameter symbol limit unit vcc applied voltage vcc ? 15 to +50 *1 v vs pin voltage(bd3004hfp) vs ? 0.3 to +15 v inh pin voltage(bd3005hfp) vinh ? 0.3 to +15 v regulator output pin voltage vout ? 0.3 to +15 v reset output pin voltage vro ? 0.3 to +15 v watchdog input pin voltage vclk ? 0.3 to +15 v reset delay setting pin voltage vct ? 0.3 to +15 v output current iout 500 ma power dissipation pd 1.6 *2 w operating temperature range topr ? 40 to +125 c storage temperature range tstg ? 55 to +150 c maximum junction temperature tjmax 150 c *1 must not exceed pd. *2 reduced by 12.8 mw/c over 25c, when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm). ver.b july 2006
2/8 z operating power supply voltage range (ta = 25c) parameter min. max. unit operating power supply voltage range 5.5* 36** v output current 500 ma * for the output voltage, consider the voltage drop (min. i/o voltage differential) due to the output current. ** must not exceed pd. z electrical characteristics (unless otherwise specified, ta = ? 40c to 125c, vcc = 13.5 v) limit parameter symbol min. typ. max. unit conditions [overall] total supply current 1 icc1 ? 80 130 a io=0ma total supply current 2 icc2 ? 80 130 a io=200ma total supply current 3(bd3005hfp) icc3 ? 80 130 a vinh=0v [regulator] output voltage vout 4.90 5.00 5.10 v input stability line.reg ? 10 20 mv vcc=6.2 25 v load stability load.reg ? 15 30 mv io=5 200ma min. i/o voltage differential ? vd ? 0.78 1.1 v vcc=4.75 v, io=200ma output current iout 500 ? ? ma vout=4.9v ripple rejection r.r. 45 55 ? db f=120hz, ein=1vrms, io=200ma [reset] detection voltage(bd3004hfp) vdet 4.02 4.10 4.18 v detection voltage(bd3005hfp) vdet 4.40 4.50 4.60 v hysteresis width vhs 50 100 150 mv output delay time low high tdlh 12 21 40 ms ct=0.1f *1 low output voltage vrst ? 0.2 0.5 v irst=2ma min. operating voltage vopl 1.0 ? ? v [watchdog timer] high-side switching threshold voltage vthh 1.16 1.26 1.36 v low-side switching threshold voltage vthl 0.20 0.24 0.28 v discharge current ictc 1 2 3 a charge current icto 3 6 10 a watchdog monitor time twh 32 51 90 ms ct=0.1f *2 watchdog reset time twl 10 17 30 ms ct=0.1f *3 clock input pulse width twclk 500 ? ? ns [inh] wdt off voltage(bd3005hfp) vuinh 3.2 ? 8.0 v wdt on voltage(bd3005hfp) vlinh 0 ? 1.8 v *1 tdlh can be varied by changing the ct capacitance value. tdlh (s) (1.26 ct (f)) / icto (a) (cal culation uses typ. values) *2 twh can be varied by changi ng the ct capacitance value. twh (s) (1.02 ct (f)) / ictc (a) (cal culation uses typ. values) *3 twl can be varied by changi ng the ct capacitance value. twl (s) (1.02 ct (f)) / icto (a) (cal culation uses typ. values) note: this ic is not designed to be radiation-resistant.
3/8 z reference data (unless otherwise specified, ta = 25c) 0 0.5 1 1.5 2 2.5 3 0 100 200 300 400 500 output current: iout [ma] dropout voltage: ? vd [v] ta =25 fig. 6 reset detection voltage output voltage: vout [v] fig. 5 ripple rejection 0 20 40 60 80 10 100 1000 10000 100000 1e+06 frequency: f [hz] ripple rejecton: r.r. [db] fig. 4 i/o voltage difference ta =-4 0 ta =12 5 fig. 10 ct pin charge vs discharge current -10 -8 -6 -4 -2 0 2 0 0.5 1 1.5 2 2.5 3 ct pin voltage: vct [v] ct pin current: ict [a] fig. 12 thermal shutdown circuit 0 1 2 3 4 5 6 100 120 140 160 180 200 ambient temperature: ta [ ] output voltage: vout [v] fig. 11 output voltage vs temperature 4.5 4.75 5 5.25 5.5 -40 0 40 80 120 ambient temperature: ta [ ] output voltage: vout [v] fig. 1 circuit current 0 20 40 60 80 100 120 0 5 10 15 20 25 supply voltage: vcc [v] circuit current: icc [a] ta =25 ta =-4 0 ta =12 5 fig. 2 output voltage vs supply voltage 0 1 2 3 4 5 6 0 5 10 15 20 25 supply voltage: vcc [v] output voltage: vout [v] fig. 3 output voltage vs load 0 1 2 3 4 5 6 0 500 1000 1500 2000 output current: iout [ma] output voltage: vout [v] ta =12 5 ta =25 ta =-4 0 ta =12 5 ta =-4 0 fig. 8 total supply current classified by load 0 0.1 0.2 0.3 0.4 0.5 0 100 200 300 400 500 output current: iout [ma] circuit current: icc [ma] fig. 9 back current -50 -40 -30 -20 -10 0 -15 -12 -9 -6 -3 0 supply voltage: vcc [v] circit current: icc [a] fig. 7 reset detection voltage temperature ambient temperature:ta[ ] 3.8 4.0 4.2 4.4 4.6 4.8 -40 0 40 80 120 bd3005hfp bd3004hfp 0 2 4 6 8 10 0 1 2 3 4 5 bd3005hfp bd3004hfp detection voltage: [v] reset voltage: vreset[v] ta =25 rising edge detection voltage falling edge detection voltage rising edge detection voltage falling edge detection voltage
4/8 z block diagram cin: 0.33 f to 1000 f co: 0.1 f to 1000 f ct: 0.001 f to 22 f fig.13 z pin descriptions pin. no pin name function 1 clk clock input from microcontroller vs(bd3004hfp) reset detection voltage adjustment function pin 2 inh(bd3005hfp) wdt on/off function pin (wdt off when inh = high; wdt on when inh = low) 3 vcc power supply pin 4 gnd gnd pin 5 out voltage output pin 6 reset reset output pin 7 ct reset output delay time, wdt monitor ti me setting external ca pacitance connection pin fin gnd gnd pin z i/o circuit diagram clk (1 pin) vs(2 pin) inh (2 pin) out (5 pin) reset (6 pin) ct (7 pin) fig.14 * all resistance values are typical ones. prereg vcc 100k hrp7 1 2 3 4 5 6 7 fin out out 470k reset vcc rb ra out vcc prereg 100k clk out ct out vcc 100k prereg 3.56m 1.56m vs vs wdt pre reg tsd vref out out vcc cl k gnd out reset ct ocp reverse polarity protection out fin co cin ct inh bd3004hfp bd3005hfp microcontroller signal from inh 3 2 2 1 4 7 6 5
5/8 detection voltage adjustment fig.15 z timing chart fig.16 z explanation (1) when the output voltage (vout) reaches 1.0 v, the reset pin voltage (reset) will switch to low level. (2) when vout reaches or exceeds the reset clear voltage (vdeth) , the external capacitor connected to the ct pin will begin to charge. when the ct pin voltage (vct) reaches the upper switching thre shold voltage (vthh), reset will maintain a low-level signal. wh en vct reaches the vthh voltage, reset will swit ch from low to high level. the time from vct reaching or exceeding the vdeth volta ge until reset reverses (the reset transmission delay ti me: tdlh) is given by the following equation: tdlh (s) (1.26 ct (f)) / icto (a) ? ? ? [1] (3) the watchdog timer operates when reset rises. (4) when vct reaches the lower switching threshold voltage (vthl), the ct pin switches from discharging to charging, and reset switches from high level to low level. the watchdog ti mer reset time twl is given by the following equation: twl(s) (1.02 ct (f)) / icto (a) ? ? ? [2] (5) the ct pin state switches from charge to discharge w hen vct reaches vthh, and reset switches from low to high. the watchdog timer monitor time twh is given by the following equation: twh(s) (1.02 ct (f)) / ictc (a) ? ? ? [3] (6) the ct pin state may not switche from charge to di scharge when the clk input pulse width (twclk) is short. use a twclk input pulse width of at least 500 ns. (7) when a pulse (positive edge trigger) of at least 500 ns is input to the clk pin wh ile the ct pin is discharging, vct switch es from discharging to charging and then switches back to discharging once it charges to vthh. (8) watchdog timer operation is forced off when the inh pin switc hes to high. at that time, only the watchdog timer will be tur ned off, and reset detection will operate normally. (9) the watchdog timer function turns on when the inh pin switches to low. at that time, the external capacitor on the ct pin w ill be discharged. (10) reset switches from high to low when out falls to the reset detection voltage (vdet) or lower. (11) when vout falls to 0 v, the reset signal stays low until vout reaches 1.0 v vout vinh clk vct reset (4) (5) vcc (1) (2) (3) (4) (7) (5) (6) (4) (5) (8) (9) (10) (3) (11) (10) 0 twh when vinh = high wdt current off twclk twl twclk vthh vthl (2) (10)(2) (4) (5) vdeth vdet tdlh 0 0 0 0 0 (3) vhs vdeth = vdet + vhs out r4 vs detection voltage 1,25v(typ.) r2=3.56m r1=1.56m r3 (all resistance values are typical ones.) for a basic detection voltage of 4.1 v, vdet = vs (r1 + r2 / r1) to change the detection voltage, insert pull-down resistor r3 (with a resistance value lower than r1) between the vs and gnd pins, and pull-up resistor r4 (with a resistance value lower than r2) between the vs and vo pins. vdet = vs (r3 + r4 / r3) [r3< 6/8 z setting of heat fig.17 refer to the dissipation reduction illustrated in fig. 17 when using the ic in an environment where ta 25c. the characteristics of the ic are greatly influenced by the operating temperature. if the temperat ure exceeds the maximum junction temperature tjmax, the element s of the ic may be damaged. it is necessary to give suff icient consideration to the heat of the ic in view of two points, i.e., the protect ion of the ic from instantaneous damage and the maintenance of the reliability of the ic in long-time operation. in order to protect the ic from thermal destruction, the operati ng temperature of the ic must not exceed the maximum junction t emperature tjmax. fig.17 illustrates the power dissipati on/heat mitigation characteristics for the hrp-7 package. always operate the ic wi thin the power dissipation (pd). the following method is used to calculate the power consumption pc (w). pc = (vcc ? vout) iout + vcc icc vcc : input voltage power dissipation pd pc vout : output voltage iout : load current the load current io is obtained to operate the ic with in the power dissipation. icc : total supply current pd ? vcc icc iout vcc ? vout for icc, see fig. 1. from the above, the maximum load current ioutmax for the app lied voltage vcc can be calculated during the thermal design proces s. calculation example example: at ta = 85c, vcc = 12 v, vout = 5 v 0.832 ? 12 icc iout 12 ? 5 iout 118 ma (icc = 80 a) make a thermal calculation in considerat ion of the above equations so that the whole operating temperature range will be within the power dissipation. the power consumption pc of t he ic, in the event of shorting (i.e., if t he vo and gnd pins are shorted), will be o btained from the following equation: pc = vcc (icc + ishort) ishort = short current z external settings for pins and precautions 1) vcc pin insert capacitors with a capacitance of 0.33 f to 1,000 f between the vcc and gnd pins. the capacitance varies with the application. be sure to design the capacitance with a sufficient margin. 2) output pin capacitors for stopping oscillation must be placed between each out put pin and the gnd pin. capaci tor capacitance values can be used in a range between 0.1 f and 1,000 f. since oscillation does not occu r even for esr values from 0.001 ? to 100 ? , a ceramic capacitor can be used. abrupt input volt age and load fluctuations can affect output vo ltages. output capacitor capacitance valu es should be determined after sufficient testing of the actual application 3) ct pin be sure to connect a capacitor to the ct pin. the reset output delay time is given by equation (1) on p. 5. the wdt time is giv en by equations (2) and (3) on p.5. the setting times are proportional to the capacitance value of ct pin from the equations, so the maximum and minimum setting times can be calculated from the electrical characteristics accordi ng to the capacitance. note however that the electrical characteristics do not include t he external capacitor's temperature char acteristics. the recommended connection capa city for the ct pin is 0.001 f to 22 f. 0 25 50 75 125 150 100 0.4 0 0.8 1.2 1.6 2.0 rohm standard board board size: 70 mm 70 mm 1.6 mm ja = 78.1 (c /w) ambient temperature: ta [ ] power dissipaton: pd [w] ja = 78.1c/w ? 12.8 mw/c 25c = 1.6 w 85c = 0.832 mw
7/8 z operation notes 1. absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify br eaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute ma ximum ratings, consider adding circuit protection devices, such as fuses. 2. gnd voltage the potential of gnd pin must be minimu m potential in all operating conditions. 3. thermal design use a thermal design that allows for a sufficient margin in li ght of the power dissipation (pd) in actual operating conditions. 4. inter-pin shorts and mounting errors use caution when positioning the ic for mounting on printed ci rcuit boards. the ic may be damage d if there is any connection er ror or if pins are shorted together. 5. actions in strong electromagnetic field use caution when using the ic in the pr esence of a strong electromagnetic field as doing so may cause the ic to malfunction. 6. testing on application boards when testing the ic on an application board, connecting a capacitor to a pin with low impedance subjects the ic to stress. alwa ys discharge capacitors after each process or step. always turn t he ic's power supply off before connecting it to or removing it f rom a jig or fixture during the inspection process. ground the ic during assemb ly steps as an antistatic measur e. use similar precaution whe n transporting or storing the ic. 7. regarding input pin of the ic this monolithic ic contains p+ isolati on and p substrate layers between adjacent el ements in order to keep them isolated. p-n junctions are formed at the intersection of these p layers with the n laye rs of other elements, creating a parasitic diode or transistor. for example, the relation between each potential is as follows: when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction oper ates as a parasitic transistor. parasitic diodes can occur inevitable in the structure of the ic . the operation of parasitic diodes can result in mutual interf erence among circuits, operational faults, or physical dam age. accordingly, methods by which parasitic diodes operate, such as applying a vo ltage that is lower than the gnd (p substrate) vo ltage to an input pin, should not be used. 8. ground wiring pattern when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a si ngle ground point at the ground potential of application so that th e pattern wiring resistance and voltage variations caused by larg e currents do not cause variations in the small signal ground voltage. be care ful not to change the gnd wiring pattern of any external compon ents, either. 9. thermal shutdown circuit (tsd) the ic incorporates a built-in thermal shut down circuit (tsd circuit). the thermal shut down circuit (tsd ci rcuit) is designed o nly to shut the ic off to prevent runaway thermal operation. it is not designed to protect the ic or guarantee its operation. do not contin ue to use the ic after operating this circuit or use the ic in an environment where the operation of this circ uit is assumed.. (see fig. 12) 10. overcurrent prot ection circuit (ocp) the ic incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. this circ uit serves to protect the ic from damage when the load is s horted. the protection circui t is designed to limit current flow by not latching i n the event of a large and instantaneous current flow originating from a large capacitor or other component. these protection circuits are eff ective in preventing damage due to sudden and unexpected accidents. however, t he ic should not be used in applic ations characterized by t he continuous operation or transitioning of the protection circuits. at the time of ther mal designing, keep in mind that the curre nt capability has negative characteristics to temperatures. (see fig. 3) 11. negative surge application to vcc pin the ic incorporates a built-in reverse c onnection breakdown prevention ci rcuit that prevents ic damage even if vcc carries a lo wer voltage than the gnd pin. however, note that the absolute ma ximum rating for the negative power supply voltage is -15 v. 12. back current flow when the vcc power supply is suddenly interrupted these ics limit generation of back current flow when the vcc pow er supply is suddenly interrupted to protect the ic from damage . sinking current is also limited, making the series compatible with des igns where high-capacitance capacitors are used to lengthen the a mount of time over which the output voltage can be maintained. gnd n p n n p+ p+ parasitic element or transistor p substrate (pin b) c b e transistor (npn) parasitic element (pin a) gnd n p n n p+ p+ resistor p parasitic element (pin a) parasitic element or transistor (pin b) gnd c b e fig. 18 example of ic structure
8/8 z selecting a model name when ordering b rohm model name part number 3004 adjustable detection voltage 3005 stable detection volta g e package type hfp: hrp7 taping tr: reel-wound embossed taping d 0 3 4 p t r 0 f h catalog no.06t148a '06.7 rohm c 1000 tsu direction of feed 1 p in reel x x x x x x x x x x x x x x x x x x x x x x x x hrp7 (unit:mm) when you order , please order in times the amount of package quantity. embossed carrier tape tr (the direction is the 1pin of product is at the upper light when you hold reel on the left hand and you pull out the tape on the right hand) tape quantity direction of feed 2000 p cs 7 6 5 4 3 2 s 1 0.73 0.1 1.27 0.8875 1.905 0.1 0.835 0.2 1.523 0.15 10.54 0.13 0.27 4.5 0.08 0.08 0.05 (max 9.745 include burr) s 9.395 0.125 - 0.05 + 0.1 - 4.5 + 5.5 8.82 ? 0.1 (5.59) 1.017 0.2 8.0 0.13 (7.49)
notes no technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of rohm co.,ltd. the contents described herein are subject to change without notice. the specifications for the product described in this document are for reference only. upon actual use, therefore, please request that specifications to be separately delivered. application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. rohm co.,ltd. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by rohm co., ltd. is granted to any such buyer. products listed in this document are no antiradiation design. appendix1-rev2.0 thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact your nearest sales office. rohm customer support system the americas / europe / asia / japan contact us : webmaster@ rohm.co. jp www.rohm.com copyright ? 2008 rohm co.,ltd. the products listed in this document are designed to be used with ordinary electronic equipment or de vices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of which would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. it is our top priority to supply products with the utmost quality and reliability. however, there is always a chance of failure due to unexpected factors. therefore, please take into account the derating characteristics and allow for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in order to prevent possible accidents that may result in bodily harm or fire caused by component failure. rohm cannot be held responsible for any damages arising from the use of the products under conditions out of the range of the specifications or due to non-compliance with the notes specified in this catalog. 21 saiin mizosaki- cho, ukyo-ku, kyoto 615-8585, japan tel : +81-75-311-2121 fax : +81-75-315-0172 appendix
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